What We Do  

We are focused on design and development of next generation firmware architecture and algorithms to deliver high performance and cost-efficient enterprise Hard Disk Drive (eHDD) products. As part of the globally diverse R&D team, you will be working in an Agile development environment with opportunity to learn and grow in multiple disciplines.   

We are seeking highly motivated students to join our RAMP Internship Program. These paid internships are designed to jump start your career, offering on-the-job and supplemental training in addition to robust mentorship. You will work alongside the brightest minds in the industry to drive the innovation necessary to outpace new demands and challenges created by data.   

What is the RAMP Program? The RAMP Program is supplemental to your day-to-day intern responsibilities. In this program, you will take a deeper dive into professional life at Western Digital by getting exposure to different parts of the organization. Some RAMP Program elements include: 

• On the job training and mentorship with industry professionals  

• Professional development trainings  

• Executive exposure   

• Networking events with other interns and Western Digital employees  

• Collaboration opportunities with cross-geographical & cross-cultural teams especially the team in Japan & US.  

This position is based in Western Digital Tech and Regional Center (M), which is a Center of Excellence located in Petaling Jaya, Malaysia.  

What You Will Do  

ESSENTIAL DUTIES AND RESPONSIBILITIES:  

• Design, develop, test, integrate and maintain quality firmware for eHDD using best practices like unit test, CI and Agile methodologies.  

• Design and implementation of data structures, software algorithms, data path, and drivers for hardware cores using latest standards C++ and Python.   

• Participate in significant technical investigations from problem statement to conclusions.  

• Creates design documents pertinent to the various phases of firmware development.  

• Devise strategies for in-depth functionality and compatibility testing of complex drive features. 

• The Staff Engineer defines, develops and qualifies new semiconductor packages and maintains quality of existing packages. 
• Represents Package Engineering in cross-functional teams and ensures that packages are characterized, qualified and introduced into production in a timely manner while meeting all electrical, performance, reliability and quality requirements.  
• Take responsibility for product DPPM, as well as new Technology development programs and new NAND/ASIC development Quality and Reliability.  
• Develop a comprehensive quality guidance library encompassing engineering work criteria, statistical Design of Experiments (DOE), Scorecard, sampling plans, and metric/methodology instructions.  
• Address quality cases in technology and product development using DMAIC, RCA, and 8DR methodologies.  
• Coordinates with factories worldwide on the high-volume introduction of new packages and assembly processes. Manages assembly yield improvement and package cost reduction programs.  

• Develop and implement a comprehensive technology strategy that aligns with Fresh Futures' goals in education and job placement.
• Oversee the design, development, and maintenance of the company’s technology platforms, ensuring they are user-friendly, secure, and scalable.
• Lead and mentor the IT and development teams, fostering a culture of innovation and excellence.
• Collaborate with executive leadership to identify technological opportunities that enhance our service offerings and improve the customer experience.
• Drive the research and development of new tools, platforms, and technologies to keep Fresh Futures at the cutting edge of the industry.
• Ensure compliance with relevant data protection and cybersecurity regulations.
• Manage relationships with third-party vendors and technology partners.
• Stay current with emerging technologies and assess their potential impact on our business.

Job Target:

Responsible for new machine start-up from installation to documentation, improve/maintain machine performance and troubleshoot/repair/modify machine.

Job Description:

• In charge for new machine start-up from installation/modification to documentation.
• Conduct machine performance monitoring, breakdown analysis and carry-out improvement activity.
• Isolate machine breakdown report/verify machine breakdown report issued by STL/TL.
• Perform PM, house-keeping and calibration on the machine.
• Initiate troubleshooting and repair of major systems breakdown.
• Work on the development and improvement of machines/equipment/tools/system.
• Maintain reliable and safe manufacturing systems while improving productions rates efficiencies, yields, costs and changeovers.
• Implement PDCA cycle in all activity done and complete any other tasks assigned by superior.
• Guide TL/STL on technical skill improvement.
• Performs a variety of tasks assigned by superior.

Job Requirement:

• Candidate should possess a Bachelor Degree or equivalent in Engineering (Electrical / Electronic),Engineering (Mechanical),Engineering (Mechatronic / Electromechanical) or related technical degree.
• Preferably at least 2 years of related working experience in field of Electrical and Automation in manufacturing. Has exposure to TPM, preventive maintenance planning and/or maintenance execution.
• Possess analytical thinking and strong technical skills, Proficient in Design/Drafting Tools (SolidWorks/AutoCAD) anf Skilled in PLC & HMI programing, PLC hardwiring of following PLC (Keyence, Mitsubishi etc)
• Good communication skills in English, Malay language for both spoken and written. Japanese communication skills is advantage.